摘要
近年來消費性電子產品的快速發展，大多重於強大的功能與產品的多元化，其體積隨之要求更小更薄了。因此，表面黏著元件(Surface Mount Devices；SMD)在製程應用上也一直挑戰製程與設備的極限，而在表面黏著技術(Surface Mount Technology；SMT)的製程仍存在著許多的變異因子，一直不停地影響著生產的良率，而其中印刷機的錫膏印刷便是最大的變異。然而，業界對於印刷製程參數的設定並於一定最佳化的標準，往往都是從試誤法中尋找最佳製程參數。本研究乃針對錫膏印刷製程，將以心智圖法找出關鍵因子，再以實驗設計法找錫膏印刷的最佳參數，並以ANOVA分析驗證變異因子的顯著程度。結果顯示，影響錫膏的印刷品質有刮刀速度、刮刀壓力及脫模速度等三個因子，其最佳參數：刮刀速度為20mm/s、刮刀壓力為40N、脫模速度為5mm/s。本研究希望能藉由本實驗的步驟及結果提供業界在錫膏印刷的製程品質參數設定的重要參考依據。
關鍵字：實驗設計、SMT、錫膏印刷。
ABSTRACT
As in recent fast development of consuming electronic products, most of which emphasize the powerful function and diversity, become smaller and thinner. Therefore, in process application, Surface Mount Devices keeps challenging the limit of the process and the equipment. However, there are still many changing factors existing in the Surface Mount Technology process, influencing the production yield. Solder paste printing in copy machines is the biggest variation. Yet, there is no optimal standard in parameter set up in printing process. More often, the best process parameter was found from trials. This research, aiming on solder paste printing process, looks for the best parameter of solder printing with empirical design. The prominent level is tested by ANOVA. The results show that the factors influencing solder paste printing quality are blade speed, blade pressure, and unmolding speed. The best parameter for each of the factor is blade speed: 20mm/s; blade pressure: 40N; unmolding speed 5mm/s. By the procedures and results of the experiment, this study hopes to provide a reference of the parameter set up in solder paste printing quality for the industry.
Keywords: DOE; SMT; Solder Paste Printing
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